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Electronic Packaging Reflow Shape Prediction for the Solder Mask Defined Ball Grid Array
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The increasing need to create high density and fine pitch electronic interconnections presents a number of challenges. The fatigue-induced solder joint failure of surface mounted electronic devices ...
An Effective Approach for Three-Dimensional Finite Element Analysis of Ball Grid Array Typed Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In the literature, the local-global finite element analysis technique plays a very important role in the area array packaging. In this study, the underlying goal is to propose an improved ...
Process Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Development of flip-chip-on-glass (FCOG) assembly technology using anisotropic conductive adhesive/film (ACA/ACF) is currently underway to achieve fine pitch interconnections between driver IC and ...
Parametric Design and Reliability Analysis of Wire Interconnect Technology Wafer Level Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The demands for electronic packages with lower profile, lighter weight, and higher input/output (I/O) density have led to rapid expansion in flip chip, chip scale package (CSP) and wafer level ...